| 发明名称 |
Integrated circuit package with overlapped die on a common lead frame |
| 摘要 |
This invention is for an integrated circuit package which includes two integrated circuit die connected to a common substantially planar lead frame, wherein bond pads on each die face the common lead frame.
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| 申请公布号 |
US5585668(A) |
申请公布日期 |
1996.12.17 |
| 申请号 |
US19960601880 |
申请日期 |
1996.02.15 |
| 申请人 |
STAKTEK CORPORATION |
发明人 |
BURNS, CARMEN D. |
| 分类号 |
H01L23/433;H01L23/495;(IPC1-7):H01L23/50;H01L23/10;H01L27/10;H01L23/28 |
主分类号 |
H01L23/433 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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