| 摘要 |
<p>PURPOSE: To obtain an adhesive tape for electronic part, capable of securing insulating properties in bonding a lead frame and omitting adhesion process for bonding a radiation plate to an adhesive type by laminating an adhesive layer comprising a specific constitution onto at least one face of a metal plate. CONSTITUTION: This adhesive tape is obtained by laminating an adhesive layer composed of two or more semi-cured layers cured till B stage, mutually different in hardness and obtained by blending (A) 100 pts.wt. piperazinylethyl- aminocarbonyl-containing acrylonitrile copolymer of formula I [when (n) is 1, (k) is 3-175 and (m) is 0.3-93], having 10,000-200,000 weight-average molecular weight, 5-50wt.% acrylonitrile content and 500-10,000 amino group equivalent with (B) 10-90 pts.wt. compound containing two or more maleimide groups selected from a compound of formula II, formula III, etc., onto at least one face of a metal plate so that the semi-cured layer having high hardness is situated on the metal plate side. The curing degree can be controlled by blend amount, etc., of a reaction accelerator.</p> |
