| 摘要 |
PURPOSE: To dissipate heat effectively from a power element, e.g., a semiconduc tor element. CONSTITUTION: The multilayer board 2 is formed by laminating three insulation layers 1a, 1b, 1c. A conductor for heat conduction, i.e., a heat sink S1 made of a filling metal 4a, is formed in the insulation layer 1a of multilayer board 2 and a conductor for heat conduction, i.e., a heat sink S2 made of a filling metal 4b, is formed in the underlying insulation layer 1b. The heat sinks S1, S2 are extending in parallel with the surface layer of multilayer board 2, i.e., in the lateral direction on the drawing. The heat sink S2 has lateral length longer than that of the heat sink S1 and the heat sinks S1, S2 are formed in pyramid. A power element 6 is mounted on the heat sink S1. Heat generated from the power element 6 is dissipated downward at an angle of about 45 deg. through the heat sinks S1, S2. |
