Assembly and method for wire encapsulation within head gimbal assemblies of DASD files

摘要

A method and assembly are disclosed for bundling wires utilized in a head gimbal assembly of a magnetic disk storage device. According to the method of the present invention, a number of wires are routed along a predetermined path on a surface of the arm of the head gimbal assembly. While the wires are maintained along the predetermined path, an adhesive is dispensed at selected locations along the predetermined path. According to a preferred embodiment of the present invention, the adhesive is applied in a contiguous manner along the length of the wires extending beyond the end of the arm. Finally, the adhesive is cured to encapsulate a portion of the wires within a sleeve of adhesive. In an alternate embodiment of the present invention, the adhesive is dispensed over the wires in a plurality of non-contiguous segments.