| 摘要 |
PURPOSE: To obtain a wiring board excellent in the dimensional accuracy, without defects, by providing a resin-filling process charging a photosetting resin in the clearance among wires formed on the surface of the board and a pressing process forming a smooth face with the wiring and the resin and simultaneously proceeding with the pressing process and the resin-filling process. CONSTITUTION: In producing a wiring board 12, metal wiring 10 is formed at first on the surface of a glass board 2 to make an intermediate board 20. Next, a resin monomer liquid 22 is dripped on the surface of a flat and smooth plate 23 by use of a dispenser 21. Then, the intermediate board 20 is closely stuck to the flat and smooth plate 23 and the resin monomer liquid 22 is charged among the metallic wiring 10. And the board is set in a press 50 and pressed with a slide member 32 to form a flat and smooth face with the metallic wiring 10. In a state further pressurized, UV light 52 is projected from the side face of the glass plate 51 to cure the resin monomer liquid 22. Thereafter, the flat and smooth plate 23 and the intermediate board 20 are taken out of the press 50 and the glass board 2 is separated from the flat and smooth plate 23 to obtain the wiring board 12. |
