发明名称 Polyamic acid composition
摘要 Disclosed herein is a polyamic acid composition which comprises an aromatic carboxylic acid compound having phenolic hydroxyl groups, polyamic acid, and a photosensitizer made of a diazide compound, and which can form a polyimide film pattern having a high resolution and capable of firmly adhering to a substrate.
申请公布号 US5585217(A) 申请公布日期 1996.12.17
申请号 US19950453753 申请日期 1995.05.30
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 OBA, MASAYUKI
分类号 C08G73/10;C08L79/08;G02F1/1337;G03F7/023;(IPC1-7):G03F7/023 主分类号 C08G73/10
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