发明名称 IN-MOLD COATING MOLDING METHOD AND APPARATUS
摘要 PURPOSE: To form a film of high quality having good dimensional accuracy by lifting a movable platen at a time of the filling with a coating material after the solidification of a primary molded product to provide a secondary space between the primary molded product and a movable mold and performing level adjustment by using a precise mold opening quantity control device. CONSTITUTION: The reference point of the platen adjusting mechanism 11 between a movable mold 2 and a fixed mold 4 is adjusted and a movable platen 3 is allowed to gradually fall to be moved up to a mold clamping position where the movable mold 2 comes into contact with the fixed mold 4. After mold clamping, the cavity formed by both molds is filled with a molten resin and the resin is solidified to obtain a primary molded product. Next, predetermined force is applied to the respective corresponding receiving parts 29 by respective adjusting rods 14 to lift the movable platen 3 by the quantity corresponding to the film thickness of a coating material to form a secondary space between the primary molded product and the movable mold to fill the same with the coating material but, when biased pressure is generated by filling at this time, the deviation of the forces F2 generated by the adjusting rods 14 is operated and a screw shaft part 16 is rotated to keep the movable platen 3 horizontal. After the coating material is solidified, a molded product is taken out.
申请公布号 JPH08332655(A) 申请公布日期 1996.12.17
申请号 JP19950142975 申请日期 1995.06.09
申请人 UBE IND LTD 发明人 KURANASHI YOSHIZO;OKAHARA ETSUO;NAKAI KAICHIRO
分类号 B29C45/64;B29C45/14;B29C45/16;B29C45/56;B29C45/76;B29L9/00;(IPC1-7):B29C45/56 主分类号 B29C45/64
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