发明名称 |
Drop-covering mass for electric and electronic devices |
摘要 |
Heavily filled UV-curable epoxy resin compounds are proposed for the drop-type covering of, in particular, unencapsulated electrical and electronic circuits and devices. Compared with the thermally cured catalysed resins hitherto used, which were mainly of the 2-component type, these coverings, are better in terms of handling and properties. <IMAGE> |
申请公布号 |
EP0386473(B1) |
申请公布日期 |
1996.12.11 |
申请号 |
EP19900102249 |
申请日期 |
1990.02.05 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BAYER, HEINER, DR. RER. NAT.;LEHNER, BARBARA;FRITSCH, HANS-PETER;WOHAK, KURT, DR. PHIL. |
分类号 |
H01L21/312;H01L21/56;H01L23/29;H05K3/28 |
主分类号 |
H01L21/312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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