| 摘要 |
PURPOSE: To improve heat resistance necessary for injection molding, mechanical strength, and high-temp. bending strength by compounding a phenolic resin with at least one di(hydroxyphenyl)methane and at least one alkoxysilane compound. CONSTITUTION: A phenolic resin in an amount of 100 pts.wt. which is any of resol, novolak, and aralkyl resins is mixed with 5-20 pts.wt. at least one compound selected from among 4,4'-di(hydroxyphenyl)methane, 2,4'-di(dhydroxyphenyl)methane, and 2,2'-di(hydroxyphenyl)methane and 5-60 pts.wt. at least one compound selected betweenγ-aminopropyltriethoxysilane and phenyltriethoxysilane at room temp. by means of a mixer. The mixture is kneaded with heated mixing rolls, etc., optically together with reinforcing fibers and other additives. After heating, the mixture is pulverized with a pulverizer to obtain a phenolic resin composition for use as an injection molding material. |
