Semiconductor module having multiple circuit boards

摘要

A semiconductor module includes a plurality of circuit boards superposed one on another, each circuit board having two opposed surfaces; and groups of electronic parts mounted on the two opposed surfaces of each of the circuit boards, the groups of electronic parts including IC packages, each IC package having a package body and leads extending outward from at least one side surface of the package body, wherein the IC packages mounted between an adjacent pair of the circuit boards in a back-to-back relationship are located on the circuit board so that the leads of one of the IC packages on one of the circuit boards are directly opposite the package body of an IC package on the other of the circuit boards.