ADHESIVE TAPE FOR ELECTRONIC PART AND LIQUID ADHESIVE

摘要

PURPOSE: To obtain the subject tape having heat resistance, reliability, etc., and useful for bonding a lead pin, a radiation plate, etc., by laminating an adhesive layer of a polyimide resin containing a specific recurring structural unit. CONSTITUTION: This adhesive tape is obtained by laminating an adhesive layer comprising a polyimide resin having a recurring structure unit of formula I [X is SO. or C(=O)-OCH2 CH2 OC(=O); R<1> to R<4> are each a 1-4C alkyl or a 1-4C alkoxy] onto at least one face of a heat-resistant film (preferably a polyimide resin film). The polyimide resin contains preferably 50-99 mol% structural unit of formula I and 50-1mol% structural unit of formula II (Ar is a divalent group having 1-6 benzene rings, excepting a tetraalkyl substituent product of diphenylmethane or a tetraalkoxy substituent product of diphenylmethane). The adhesive layer contains preferably 1-50wt.% filler having <=1μm particle diameter.