| 摘要 |
PURPOSE: To activate the surface of a heat-treated Ni-B electroless plating film. CONSTITUTION: An Ni-B electroless plating film is formed 2-5μm thicker than the specified film thickness, the film is heated in a nonoxidizing atmosphere, and then the surface layer of the film is removed by etching to obtain a specified thickness. For example, the Ni-B electroless plating film is formed 2-5μm thicker than specified, pin brazing is applied in a nonoxidizing atmosphere, then etching is conducted to obtain a specified thickness, substitution gold plating is performed, and a chip is soldered to produce an IC package. Consequently, the depositing rate of the substitution gold plating is increased, and the solder wettability is improved.
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