发明名称 Polyamide resin composition
摘要 There is disclosed a polyamide resin composition containing: (A) 85 to 95 parts by weight of a polyamide resin; (B) 5 to 15 parts by weight of wollastonite; (C) 3 to 10 parts by weight, to 100 parts by the total weight of ingredients (A) and (B), of a styrene copolymer modified with at least one modifier selected from the group consisting of unsaturated carboxylic acids and unsaturated dicarboxylic anhydrides; and (D) 0.5 to 5 parts by weight, to 100 parts by the total weight of ingredients (A) and (B), of a high-density polyethylene modified with at least one modifier selected from the group consisting of unsaturated carboxylic acids and unsaturated dicarboxylic anhydrides, the high-density polyethylene having a weight-average molecular weight of 50,000 to 400,000.
申请公布号 US5583177(A) 申请公布日期 1996.12.10
申请号 US19940257563 申请日期 1994.06.10
申请人 TOYO BOSEKI KABUSHIKI KAISHA;AISIN SEIKI KABUSHIKI KAISHA 发明人 KINOSHITA, KOJI;YOSHIHARA, NORI;HAYASHI, MINORU;NAKAI, KIYOTAKA
分类号 C08K3/00;C08K3/22;C08L23/02;C08L25/08;C08L25/10;C08L77/00;(IPC1-7):C08L77/00;C08L83/02 主分类号 C08K3/00
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