| 摘要 |
PCT No. PCT/EP92/02991 Sec. 371 Date Jun. 13, 1994 Sec. 102(e) Date Jun. 13, 1994 PCT Filed Dec. 16, 1992 PCT Pub. No. WO93/11925 PCT Pub. Date Jun. 24, 1993.An apparatus for encapsulating with plastic lead frames having chips arranged thereon includes mutually movable mold halves (102, 103). In the closed position a mold cavity is bounded, in which molding material is arranged under pressure via a runner. the pressure is provided by a plunger-cylinder (134-133) which carries up the molding material. Leaking molding material can result in adhering of the plunger to the cylinder wall, which is prevented according to the invention in that the outer wall of the plunger (134) is provided with scraping edges which scrape clean the inner wall of the cylinder (133) during operation. |
