PROCESS FOR PRODUCING ELECTRICALLY INSULATING, LOW MECHANICAL STRESS AND PERMANENT BONDS

摘要

In a process for producing electrically insulating, low mechanical stress and permanent bonds between components to be bonded, first of all suitable substances are added to an organically modified silicic acid polycondensate or organically modified silicic acid heteropolycondensate in order to adjust properties of the organically modified silicic acid polycondensate or organically modified silicic acid heteropolycondensate. The organically modified silicic acid polycondensate or organically modified silicic acid heteropolycondensate is then applied to a first component to be bonded. A second component to be bonded is then laid upon the organically modified silicic acid polycondensate or organically modified silicic acid heteropolycondensate. Thereafter the organically modified silicic acid polycondensate or organically modified silicic acid heteropolycondensate is cured.