发明名称 Sensoranordnung mit einem durch einen Joule-Thomson Kühler gekühlten Sensor und Elektronikbauteilen
摘要 A sensor assembly has a sensor (18) in the form of an IR-detector cooled by a Joule-Thomson cooler (36), from which expanded cooling gas emerges via pre-cooling heat exchanger (38). A printed circuit board (46) with electronic components (48,50) associated with the sensor (18) is mounted on a mounting flange (30). A component heat exchange assembly is mounted in heat-conductive contact with the electronic components (48,50). Each heat exchanger (54,56) receives the expanded cooling gas flowing from heat exchanger (38) in order to cool the respective electrical components. Each heat exchanger may comprise a stack of grooved silicon plates.
申请公布号 DE19520318(A1) 申请公布日期 1996.12.05
申请号 DE19951020318 申请日期 1995.06.02
申请人 BODENSEEWERK GERAETETECHNIK GMBH, 88662 UEBERLINGEN, DE 发明人 HINGST, UWE, DR., 88094 OBERTEURINGEN, DE
分类号 F25B9/02;G01J5/06;(IPC1-7):H01L23/46;G12B15/00;H05K7/20 主分类号 F25B9/02
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