发明名称 DEVICE FOR CHECKING THE PRESENCE OF SOLDERING PASTE DURING APPLICATION TO PRINTED CIRCUIT BOARDS WHICH CAN BE REFLOW-SOLDERED
摘要 The soldering paste (1) is applied by means of a doctor blade (4, 8) via a template (2) disposed on the printed circuit board (3). The object of the present invention is to propose a suitable checking device which ensures that the production process is carried out as safely as possible. This object is achieved in that the device (7, 9, 10), disposed in front of the doctor blade (4, 8) in the application direction, comprises optical or mechanical-electrical means which continuously check the volume of paste required.
申请公布号 WO9638253(A1) 申请公布日期 1996.12.05
申请号 WO1996DE00925 申请日期 1996.05.28
申请人 SIEMENS AKTIENGESELLSCHAFT;STALLJANN, HUBERT 发明人 STALLJANN, HUBERT
分类号 B23K3/06;B41F15/08;B41F15/40;H05K1/02;H05K3/12 主分类号 B23K3/06
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