发明名称 SMART MICROWAVE PACKAGING STRUCTURES
摘要 Active elements are described which modify the heating of foodstuffs and other microwave-heatable loads and which are responsive to changes of load dielectric properties with temperature or as a result of changes of state, composition or density during heating, to the presence or absence of loads, and to the presence or absence of adjacent dielectric materials. The active elements, which may be looped slots or strips, are constituted so as to be or become resonant or non-resonant during microwave heating of the load in response to the presence or absence of the load or the presence or absence of adjacent dielectric material. The elements conveniently may be constructed of electroconductive metal or artificial dielectric material.
申请公布号 WO9638352(A1) 申请公布日期 1996.12.05
申请号 WO1996CA00346 申请日期 1996.05.31
申请人 BECKETT TECHNOLOGIES CORP. 发明人 KEEFER, RICHARD, M.
分类号 B65D81/34;(IPC1-7):B65D81/34 主分类号 B65D81/34
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