发明名称 BONDED PANEL STRUCTURES
摘要 <p>A bonded panel structure comprises first and second laminates (A, B) bonded together along a line (19) extending along one edge only of the bonded panel structure. The first laminate (A, J) comprises a first layer (E, 61), a second layer (F, 67) and a corrugated layer (16, 63) between the first and second layers, and a second laminate (B, K) comprising at least one layer (H, 61) and a corrugated layer (16, 63) adjacent to said one layer. For the first laminate (A, J) one of said first and second layers is fixedly secured to the corrugated layer (16, 65) and the other layer (G, 67) is fixed to the corrugated layer along one edge margin only, and for the second laminate said one layer is fixed to the corrugated layer thereof, to permit on deformation of the bonded panel structure relative movement between some at least of the two layers, the two laminates being bonded together by a heat-softenable adhesive.</p>
申请公布号 WO1996038295(A1) 申请公布日期 1996.12.05
申请号 GB1996001331 申请日期 1996.06.03
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