发明名称 Laminat för förslutning och kapsling av elektroniska komponenter, samt sätt för dess framställning
摘要 <p>For sealing and shielding purposes, a laminate is used, including a layer of ionomer plastics bonded to a metal sheet or a metal plate. The bonding is made without any addition of adhesive agents between the plastics layer and the metal surface by pressing, in a heated state, the plastics layer against a well cleaned surface. The metal should be such a kind, that its surface is oxidized when stored in air. A multi-layer laminate is used, where one metal layer provides a good electrical shielding and an outermost metal layer provides good mechanical strength. The plastics layer at the inner side of a laminate is in the same way bonded directly to margins of electrical connector terminals made of metal.</p>
申请公布号 SE504195(C2) 申请公布日期 1996.12.02
申请号 SE19950001017 申请日期 1995.03.21
申请人 TELEFONAKTIEBOLAGET L M ERICSSON 发明人 KARL-ERIK LEEB
分类号 B65D1/00;B32B15/08;B65B11/50;B65D65/40;H05K1/02;H05K3/28;H05K9/00;(IPC1-7):B32B15/08;H05K5/06 主分类号 B65D1/00
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