SEMICONDUCTOR DEVICE AND MOUNTING METHOD THEREOF

摘要

PURPOSE: To realize excellent mounting of a millimeter wave band chip in which disturbance of impedance is suppressed at the joint. CONSTITUTION: Before a chip is MBB mounted on a board 100, pad parts 131, 132 are trimmed thinner than line parts 103, 104 such that the line on the board and chip side has substantially same thickness as the line at the joint after the chip is mounted on the board 100. Since the pad part can be made as thick as the line after the chip is mounted on the board, disturbance of impedance is suppressed at the joint and a good mounting is realized.