| 摘要 |
PURPOSE: To obtain a package for semiconductor element in which a large semiconductor element can be fixed horizontally and firmly without causing any damage and can be connected electrically and correctly with a predetermined external electric circuit. CONSTITUTION: The package for semiconductor element comprises an insulating base body 1 having a square recess 1a for receiving a semiconductor element 3, and a cover body 2 wherein protrusions 5 for mounting the semiconductor element 3 are provided in the vicinity of two opposite side faces 1b of a recess 1a made in the insulating base body 1 on the bottom face thereof.
|
