| 摘要 |
PURPOSE: To provide a bonding apparatus and a bonding method in which an operator can deal quickly with an abnormal situation when the situation is generated and which makes a bonding process efficient. CONSTITUTION: When a foreign body, e.g. an IC chip, is interposed between a pressure member 176 and a board L F, it is detected simultaneously with the proximity operation of the pressure member and the board. That is to say, when a so-called erroneous clamp is generated, it is detected quickly and surely. At least the erroneous clamp out of various abnormal situations which can be generated is detected immediately without waiting for a visual inspection or the like by an operator. The time required for detecting and dealing with the erroneous clamp is shortened considering the accumulated time which is spent to capture the various abnormal situations so as to deal with and respond to them. Thereby, a bonding process, including the detection of an abnormality, becomes efficient. |
