| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and a method for packaging a semiconductor device, which can prevent short-circuit between a bus bar and inner leads through a wire to increase its reliability. SOLUTION: A plurality of inner leads 32 are disposed on an upper side of a semiconductor chip 36 having a plurality of bonding pads formed on its upper surface. One or more bus bars 37 for power supply and grounding are formed on an upper side of the chip and at a positional level lower than tip ends 32 of the inner leads. |
