发明名称 SIMPLE SEALING PART FOR OPTICAL SEMICONDUCTOR DEVICE
摘要 PURPOSE: To entirely avert the effect of humidity to the title photosemiconductor device for improving the reliability upon the title photosemiconductor device by covering the photosemiconductor device loaded on a carrier with double- structured protective cap. CONSTITUTION: The title simple sealing part for the sealing the device by covering the whole body of the optical semiconductor device fixed on a carrier downward by a protective cap to be adhesion-fixed to the carrier is composed of an inside protective cap 14 for covering the whole body to be bonded onto the carrier 11 as well as an outside protective cap 16 for sealing the inside protective cap 14 with the bonding part of the carrier 11.
申请公布号 JPH08316505(A) 申请公布日期 1996.11.29
申请号 JP19950124623 申请日期 1995.05.24
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 HIBINO YOSHINORI;HANAWA FUMIAKI;TERUI HIROSHI
分类号 H01L23/28;G02B6/42;H01L23/02;H01L23/04;H01L31/02;H01S5/00;(IPC1-7):H01L31/02;H01S3/18 主分类号 H01L23/28
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