发明名称 TAPING DEVICE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE: To align various mechanism functional units such as a tape thermal press bonding unit, a characteristic measuring unit after taping in a vertical direction and to facilitate the regulation by providing a conveying system of a chain structure for linearly conveying a semiconductor device. CONSTITUTION: A carrier belt 7 is intermittently rotated at a constant pitch by two sprocket rollers 8a, 8b. Recesses 9 are provided at an equal interval on the belt 7, and the structure in which the resin sealed parts 2 of semiconductor devices 1 are contained in the recesses 9 is provided. The devices 1 inserted to the recesses 9 of the belt 7 by a suction nozzle 20 are horizontally intermittently conveyed upon rotation of the belt 7. A cover tape 5 is supplied onto lead wires 3, and the wires 3 of the device 1 are thermally press bonded between a paper tape 4 and the tape 5 by a tape thermal press bonding unit 16.
申请公布号 JPH08316691(A) 申请公布日期 1996.11.29
申请号 JP19950124051 申请日期 1995.05.23
申请人 NEC CORP 发明人 HONMA YASUAKI
分类号 B65G17/06;H01L21/673;H01L21/677;H01L21/68;H05K13/02;(IPC1-7):H05K13/02 主分类号 B65G17/06
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