HEAT DISSIPATION UNIT FOR ELECTRONIC APPARATUS EMPLOYING HEAT PIPE AND MANUFACTURE THEREOF

摘要

PURPOSE: To realize good thermal continuity between a block and a heat pipe while reducing the size and weight by inserting a heat pipe into a hole made through the block and locally applying an external force to the part for inserting the heat pipe thereby bringing the heat pipe and the inner wall of hole into mechanical contact. CONSTITUTION: A heat pipe 1 is inserted into a hole 41 of a block 4 and an external force is applied locally to the part for inserting the heat pipe 1 thus bringing the heat pipe 1 and the inner wall of the hole 41 into mechanical contact and coupling them thermally. The hole 41 is provided with substantially semicircular cross-section so that the heat pipe 1 has substantially semicircular cross-section at the part inserted into the hole 41. This structure enhances thermal coupling between the block 4 and the heat pipe 1 thus realizing excellent heat dissipation effect.