| 摘要 |
<p>PURPOSE: To form high-density terminals and patterns, considering their variations in shrinkage percentage, by providing wiring surfaces in each of which the portion with the wiring lattice having a fixed space and the portion with the wiring lattice having a more rough space than the fixed one are disposed respectively. CONSTITUTION: In interlayer insulation layers 11, 21, 31, 41, their shrinkages are generated in between their states before and after burning, and simultaneously, the spaces among wiring patterns 13, 23, 33, 43 and the spaces among via holes 12, 22, 32, 42 are reduced respectively. Hence, after the part terminals of parts 50, 51 with many terminals which are mounted in regions A, B are aligned with part mounting pads 14 on a board while using alignment patterns 15 provided previously, their solderings are performed. Since the alignment pattern 15 is near the part 50 with many terminals which is mounted in the region A, the distances between its respective terminals and the alignment pattern 15 become small. Therefore, the error values of the distances which are caused by their deviations in shrinkage percentage when burning become enough small in comparison with the pitch of the terminals.</p> |
