| 摘要 |
PURPOSE: To suppress restriction due to gel by forming an adhesion retardant layer on a silicon get filling the surface of a chip mounting board thereby retarding adhesion of the gel and a hard resin. CONSTITUTION: A metal substrate 3 in a power module is filled, on the surface thereof, with a silicon gel 8 and the upper surface thereof is filled with one or a plurality of substances 10 selected from a powder, a substance containing fluorine, and a substance containing silicon different from the gel. The upper surface of one or a plurality of substances is further filled with a hard resin 9, e.g. an epoxy resin composition substance. Since an adhesion retardant layer 10 is provided on the interface between the silicon gel 8 and the hard resin 9 filling the surface thereof, the gel 8 does not adhere to the hard resin 9 and restriction due to gel is suppressed. Consequently, structural defect, e.g. a void in the gel, caused by restriction of gel can be suppressed and the moisture resistance of module can be enhanced. |
