| 摘要 |
PROBLEM TO BE SOLVED: To lessen stresses and distortions by loading to the rear surface of a printed circuit card in just the opposite side of a module, giving rigidity to the printed circuit board through contact with a part of the rear surface and giving sufficient thickness and strength resistance with respect to deflection to the circuit substrate part, responding to impacts and vibrations to be applied to the module. SOLUTION: A stiffener structure 30 is loaded to the rear surface of a printed circuit card in just the opposite side of a module 10. The thickness thereof is set considerably larger than the thickness of the printed circuit substrate 15 and the width is larger than the width of the module 10. The stiffener 30 is also formed of a good conductive material having comparatively larger deflection coefficient, such as glass fiber/epoxy, etc., and is formed as a part, integrated with the printed circuit substrate at the time of production. A resistance for the deflection is generated by rigidity given to the printed circuit substrate 15 by means of the stiffener structure 30. Particularly, stresses and distortions can be lessened by preventing deflections on the side of the end pin and angular pin of the module of the card. |
