| 摘要 |
PURPOSE: To provide a semiconductor module for removing heat from semiconductor dies and a method for manufacturing the semiconductor module. CONSTITUTION: An electronic module 10 has a base plate 11 fitted in a separation structure 23. The separation structure 23 has 3 first, second and third parts. The first part is joined to an upper surface of the base plate 11, the second part is joined to a bottom surface of the plate 11, and the third part is joined to a side surface 14 of the plate 11. One of semiconductor dies 41 is joined to the first part of the separation structure 23, and the other die 41 is joined to the second part of the separation structure 23. The base plate 11 has a cavity through which fluid flows to carry out heat from the semiconductor dies 41. |
