RESIN SEALED POWER MODULE AND PRODUCTION THEREOF

摘要

PURPOSE: To prevent contamination of the inner surface of case with scattering gel or adhesion of gel to the inner surface of upper package structure at the time of low pressure defoaming by minimizing the quantity of get to be defoamed in the first stage and filling second and subsequent stage gels thereon without defoaming. CONSTITUTION: In a power module where a semiconductor element 1 is contained by means of an enclosure case 7 being set on a metal substrate 3 and a cover case 6, silicon gel 8a is injected through an injection hole 10 of the cover case 6 into the package up to a level slightly higher than a bonding wire 4. The silicon gel 8a is subjected to defoaming and thermally set. It is then cooled down to the room temperature and a second stage gel 8b is injected onto the first stage gel 8a. The second stage gel 8b is not subjected to defoaming and thermally set under same conditions as the first stage get 8a. By such a method, contamination of the inner surface of case with scattering gel or adhesion of gel to the inner surface of upper package structure can be prevented at the time of low pressure defoaming.