| 摘要 |
PURPOSE: To provide a multilayer board and a forming method therefor which enables to form through-holes by using common molds. CONSTITUTION: Through-holes 13a and 13b arranged in same conditions are formed through a first insulating layer 10a and a second insulating layer 11. Conductive layers 15a and 15b are formed in the through-holes 13a and 13b which are need to form a circuit. Conductive pattern 16a connected with the conductive layer 15 is formed on the surface 11a of the first insulating layer 10a, and conductive pattern 16b connected with the conductive layer 15b is formed on the surface 11b of the second insulating layer 10b. The first insulating layer 10a is formed on the second insulating layer 10b. By the step, a thick-film multilayer board 1 is formed by using the first insulating layer 10a and the second one 10b through which through-holes are formed under the same arranging condition. |
