SEMICONDUCTOR DEVICE, PRODUCTION METHOD THEREFOR AND SUBSTRATE THEREFOR

摘要

PURPOSE: To obtain a substrate of single side resin sealed semiconductor device suitable for mounting a highly reliable thin card or the life, a single side resin sealed semiconductor device and a production method thereof. CONSTITUTION: The substrate of single side resin sealed semiconductor device comprises a single side resin molded substrate body 11 having one major surface arranged with a wiring circuit 11a including the joints with a semiconductor element 13 and the other major surface where a planar terminal group for external connection is led out, and a metal layer 15 provided selectively in one major surface region corresponding to the cutting of runner part for feeding mold resin on the outside of the wiring circuit 11a on the substrate body 11. The wiring circuit 11a on the substrate body 11 is preferably made substantially flush with the surface of the substrate and the planarity (flatness) is not stringent may be set within the range of ±10μm when the thickness of the wiring circuit is on the order of 35μm.