发明名称 POLYSTYRENE RESIN COMPOSITION AND MOLDED ARTICLES THEREOF
摘要 A polystyrene resin composition comprising: (A) a styrene polymer composition composed of (a) 1 to 99 wt.% of a higly syndiotactic polystyrene resin, (b) 1 to 99 wt.% of a polyamide resin, (c) 0.1 to 10 wt.% of a compatibilizer being compatible with the component (a) and having a polar group reactive with the component (b), and (d) 0 to 50 wt.% of a rubbery elastomer and/or a modification thereof, which contains (B) a copper compound and an iodine compound in specific amounts and, if necessary, (C) a phenolic compound, (D) N,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxyhydrocinnamamide), (E) a thiodipropionate ester compound, (F) a copper inhibitor and/or (G) an inorganic filler each in a specific amount; and molded articles of the resin composition. The resin composition is so excellent in thermal aging resistance as to be reduced in the changes of physical properties and colors even after exposure to high temperature for long time, and is excellent in tenacity, rigidity, heat resistance, water resistance and so on, thus being suitably usable as the base material of various industrial materials.
申请公布号 WO9637552(A1) 申请公布日期 1996.11.28
申请号 WO1996JP01329 申请日期 1996.05.20
申请人 IDEMITSU PETROCHEMICAL CO., LTD.;MASUYAMA, AKITOSHI;FUKUI, HIROKI;OKADA, AKIHIKO 发明人 MASUYAMA, AKITOSHI;FUKUI, HIROKI;OKADA, AKIHIKO
分类号 C08K3/16;C08K5/00;C08L25/04;C08L25/06;C08L53/02;C08L71/12;C08L73/00;C08L77/00;C08L101/00;(IPC1-7):C08L25/06;C08K3/00;C08K3/30;C08K3/32;C08K5/09;C08K5/11;C08K5/13;C08K5/20;C08K5/24;C08K5/349;C08K5/36;C08K7/00 主分类号 C08K3/16
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