Electronic chip component, e.g. resistor, capacitor, inductor

摘要

The component has a chip body and an electrode. The latter is preferably an external electrode and is provided on part of the surface of the chip body. The electrode is made of an electrically conductive material which contains an electrically conductive powder. The electrode has numerous projections on its surface and also has a resin binder substance. The metal powder preferably forms about 60 to 96 per cent by weight of the conductive material. The metal powder may be e.g. copper powder or nickel powder. The metal powder may be coated with a rare metal from the group of Gold, Platinum, silver or Pd. The electrically conductive material may also contain silver powder and/or copper powder e.g. with a chain structure. The chip body may have a substrate. A surface electrode layer is formed on the lower side of the substrate. The chip body may also has a resistive layer on the substrate. This is electrically coupled to the electrode layer. The external electrode may be coupled to the electrode layer.