发明名称 Methode zur Herstellung eines Halbleiterchips
摘要 Semiconductor chip manufacturing method and device by which dicing data specific to the wafertype is stored on a media travelling with/on/attached to wafer(s) and being read out at dicing station by reading means, automatically setting-up the dicing euqipments. Use of bar code as such media. <IMAGE> <IMAGE> <IMAGE>
申请公布号 DE69120904(T2) 申请公布日期 1996.11.28
申请号 DE1991620904T 申请日期 1991.11.21
申请人 TOKYO SEIMITSU CO. LTD., MITAKA, TOKIO/TOKYO, JP 发明人 TANAKA, TOSHIYUKI, MITAKA-SHI, TOKYO, JP;NAKAMURA, MASAHARU, MITAKA-SHI, TOKYO, JP
分类号 B28D7/00;H01L21/301;H01L23/544;(IPC1-7):H01L23/544;H01L21/304 主分类号 B28D7/00
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