Semiconductor chip manufacturing method and device by which dicing data specific to the wafertype is stored on a media travelling with/on/attached to wafer(s) and being read out at dicing station by reading means, automatically setting-up the dicing euqipments. Use of bar code as such media. <IMAGE> <IMAGE> <IMAGE>
申请公布号
DE69120904(T2)
申请公布日期
1996.11.28
申请号
DE1991620904T
申请日期
1991.11.21
申请人
TOKYO SEIMITSU CO. LTD., MITAKA, TOKIO/TOKYO, JP
发明人
TANAKA, TOSHIYUKI, MITAKA-SHI, TOKYO, JP;NAKAMURA, MASAHARU, MITAKA-SHI, TOKYO, JP