发明名称 Washing appts. for cleaning of semiconductor substrate surface
摘要 The appts. includes a jet nozzle (11) coupled a liq. supply device (23) and a gas supply device (22). A mixer for the liq. and gas supplies the jet nozzle and forms the cleaning droplets. Pref. the jet nozzle and mixer contain two feed lines, one for the gas and the other one for the liq.. The second feed line end section extends from outside through the first feed line wall into its inside. The second feed line end section extends in the same direction as the first feed line. Several jet nozzles may be arranged in a regular spacing such that they do not intersect.
申请公布号 DE19544353(A1) 申请公布日期 1996.11.28
申请号 DE1995144353 申请日期 1995.11.28
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP;RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORP., ITAMI, HYOGO, JP 发明人 KANNO, ITARU, ITAMI, HYOGO, JP;OHMORI, TOSHIAKI, ITAMI, HYOGO, JP;TANAKA, HIROSHI, ITAMI, HYOGO, JP;DOI, NOBUAKI, ITAMI, HYOGO, JP
分类号 B08B5/02;A62C5/00;B01F3/04;B01F5/04;B01F5/06;B05B7/00;B05D1/02;B08B3/02;B08B3/10;B24B53/007;H01L21/00;H01L21/304;H01L21/306;(IPC1-7):B08B3/02;B08B5/00;B08B3/08;H01L21/302 主分类号 B08B5/02
代理机构 代理人
主权项
地址