| 摘要 |
<p>A durable two-layer flexible printed wiring board which is improved in the persistence of tenacious adhesion after heat loading, particularly so improved in the tenacious adhesion between the copper film and the polyimide film after electroless plating as not to cause delamination even after exposure to a temperature of as high as about 150 °C for a period of as long as 10 days. The board is characterized by having a first deposited metal layer, on one or both surfaces of a polyimide film containing 0.02 to 1 wt.% (based on the film) of tin, in which part or the whole of the deposited metal is dispersed in the film in the thicknesswise direction toward the inside of the film from the surface thereof and whose thickness is 10 to 300 Å, inclusive of the layer wherein the metal is dispersed, and having a second deposited copper layer on the first deposited metal layer.</p> |
