发明名称 |
Method of manufacturing a heat transmitting device and a heat transmitting device |
摘要 |
<p>This invention provides a heat transmitting pipe and a heat transmitting plate which are capable of greatly improving the heat transfer efficiency of a conventional finned heating pipe and a convention heating plate. Copper oxide powder is deposited in a vapor phase onto a cellular synthetic resin coated with an adhesive beforehand. Thereafter, a copper plate with the same metal powder deposited thereon is placed on one surface of the metal powder-bearing cellular synthetic resin and is brought into lightly pressed contact with the surface by a roll press or the like, to thereby form a laminated article. Subsequently, the cellular synthetic resin is burnt off in a combustion furnace, to thereby produce a cellular metal material of the copper oxide on the copper plate. Further, the cellular metal material is reduced and sintered in a reducing atmosphere such as that of a hydrogen reduction furnace, to thereby produce a cellular copper material which is provided with the copper plate on one surface thereof. The cellular copper material can be directly used as a material for working a heat transmitting plate in a heat exchanger. <IMAGE></p> |
申请公布号 |
EP0744586(A1) |
申请公布日期 |
1996.11.27 |
申请号 |
EP19950903987 |
申请日期 |
1994.12.27 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
HIRATSUKA, TSUGIHIKO;UCHIDA, TATSUYA;KAMIGATA, YASUO;YOSHIDA, TAKESHI;TSUBOI, HIDEFUMI |
分类号 |
B22F3/11;B22F7/00;F28F13/00;F28F13/18;F28F21/08;(IPC1-7):F28F13/02;F28F1/10 |
主分类号 |
B22F3/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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