A charge plate fabrication process uses conventional methods to fabricate the charge plate. Initially, a non-conductive charge plate substrate is provided, the substrate having an edge and a top. The substrate is then edge patterned to define a charging face on the edge of the non-conductive charge plate substrate. The conductive path from the charging face to the top of the non-conductive charge plate substrate is completed to create a charge plate. The charge plate is then top patterned.
申请公布号
CA2177053(A1)
申请公布日期
1996.11.27
申请号
CA19962177053
申请日期
1996.05.21
申请人
MORRIS, BRIAN G.;SEXTON, RICHARD W.;HARRISON, JAMES E., JR.;RIDGLEY, GREGGORY S.;LIND, KENNETH R.
发明人
MORRIS, BRIAN G.;SEXTON, RICHARD W.;HARRISON, JAMES E., JR.;RIDGLEY, GREGGORY S.;LIND, KENNETH R.