发明名称 CHARGE PLATE FABRICATION PROCESS
摘要 A charge plate fabrication process uses conventional methods to fabricate the charge plate. Initially, a non-conductive charge plate substrate is provided, the substrate having an edge and a top. The substrate is then edge patterned to define a charging face on the edge of the non-conductive charge plate substrate. The conductive path from the charging face to the top of the non-conductive charge plate substrate is completed to create a charge plate. The charge plate is then top patterned.
申请公布号 CA2177053(A1) 申请公布日期 1996.11.27
申请号 CA19962177053 申请日期 1996.05.21
申请人 MORRIS, BRIAN G.;SEXTON, RICHARD W.;HARRISON, JAMES E., JR.;RIDGLEY, GREGGORY S.;LIND, KENNETH R. 发明人 MORRIS, BRIAN G.;SEXTON, RICHARD W.;HARRISON, JAMES E., JR.;RIDGLEY, GREGGORY S.;LIND, KENNETH R.
分类号 B41J2/085;(IPC1-7):B41L27/10;B41N1/00 主分类号 B41J2/085
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