发明名称 ELEKTRISCHER ANSCHLUSSPUNKT FUER LEITERPLATTEN
摘要 An electrical interconnection board with lead sockets mounted in holes therein. The lead sockets are hollow cylindrical elements having a tapered opening at one end and a plurality of normally converging flexible fingers at the other end. The lead sockets are force fitted into the holes in the board with the receptacle end of the socket opening into the component side of the board. The invention is also concerned with the method for mounting lead sockets to electrical interconnection boards.
申请公布号 DE2744744(A1) 申请公布日期 1978.05.24
申请号 DE19772744744 申请日期 1977.10.05
申请人 AUGAT,INC. 发明人 C. HOLT,RICHARD;F. DAMON,NEIL;J. HANLON,RICHARD
分类号 H01L23/32;H01R4/02;H01R9/20;H01R12/58;H01R24/00;H01R33/05;H05K1/11;H05K1/18;H05K7/08 主分类号 H01L23/32
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