| 摘要 |
<p>PURPOSE:To cool an electronic-part package effectively, by attaching cooling means utilizing bimorph vibrators and the like to the package, in which electronic circuits are packaged as a unitary body. CONSTITUTION:A package main body 1 is constituted by a ceramic base 11, on which a semiconductor element 2 is mounted, and a ceramic cap 12. An inverted L type ceramic supporting stage 5 is bonded to the outside of the base 11 with a bonding agent such as epoxy resin so that thermally good conductivity is obtained. Piezoelectric elements 71 and 72 are stuck to both surfaces of vibrating plates 6 and bimorph vibrators are formed. Two cooling fans 8 having said structure are fixed to the stage 5 so that the package 1 is cooled from the upper part of the package 1. When an AC voltage is applied to the bimorph vibrators, the tip parts of the fans 8 are vibrated. Thus the surfaces of the base 11 is effectively cooled.</p> |
