Process for bonding semiconductor chips to a wafer

摘要

To bond semiconductor chips (2) to a wafer (1), the locally heatable regions of the latter are utilised and a thermally reacting binder (3) is used. The semiconductor chips (2) are arranged on the wafer (1) and the locally heatable regions of the wafer (1) are heated by means of passing current in such a way that the semiconductor chips (2) are bonded to the wafer (1) by the heated binder (3). The process according to the invention is used, in particular, for soldering semiconductor lasers and diodes without flux.