| 摘要 |
<p>PURPOSE: To provide an IC card with high reliability and a simple manufacturing method therefor. CONSTITUTION: In the first process S1, a printing label A is manufactured. In the second process S2, an adhesive layer 4 is provided over the whole unprinted surface of the printing label A. In the third process S3, an IC module 5 is fixed at a prescribed position on the adhesive layer 4. In the fourth process S4, an IC protective layer 6 is formed over the whole surface of the adhesive layer 4 so as to cover the whole IC module 5. In the fifth process S5, a raw material obtained from the first process S1 to the fourth process S4 is disposed at a metallic mold (a), and after closing the other metallic mold, an injection molding resin is injected to manufacture an IC card.</p> |
