| 摘要 |
<p>PURPOSE: To further miniaturize a device in the immersion plating of a wafer and to make up for the defect of the immersion plating that the nonuniformity tends to cause when a plating soln. is circulated. CONSTITUTION: A wafer U is held between the front covering material 2 and rear covering material 3 using plastic film, etc., the front covering material is firmly attached to the wafer surface around a plating opening 5, the front covering material is firmly attached to the rear covering material on the circumference of the wafer, hence the rear of the wafer is protected from a plating soln., and the wafer is plated. Consequently, the wafer protective structure against the plating soln. is remarkably thinned, the device is miniaturized, and the uniformity of plating is enhanced.</p> |
