发明名称 METHOD AND APPARATUS FOR RESIN SEAL MOLDING OF ELECTRONIC COMPONENT
摘要 PURPOSE: To prevent the formation of internal voids and depleted parts to a resin sealed molded object. CONSTITUTION: The molten resin material to be injected into cavities 3, 4 is branched by the molten resin material branch part 16 arranged to the gate 9a of a transfer resin passage 9 to be allowed to flow in and transferred to the cavities 3, 4 while large air bubbles in the molten resin material are dispersed as small air bubbles. Further, by applying a predetermined resin pressure to the molten resin material injected into the cavities 3, 4 by a plunger 6, small air bubbles in the cavities 3, 4 are compressed to a negligible fine shape to prevent internal voids and depleted parts from being formed to a resin sealed molded object.
申请公布号 JPH08309788(A) 申请公布日期 1996.11.26
申请号 JP19950145519 申请日期 1995.05.18
申请人 TOWA KK 发明人 OSADA MICHIO
分类号 B29C33/10;B29C45/02;B29C45/14;B29C45/34;B29K105/20;B29L31/34;H01L21/56;(IPC1-7):B29C45/14 主分类号 B29C33/10
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