| 摘要 |
A method of manufacturing a printed wiring board by a build-up technique improves the bonding force between a conductor circuit and a resin. After the surface of the first conductor pattern is roughened by oxidation, an insulating layer is formed to expose a viahole portion of the first conductor pattern. Then the resin insulating layer is roughened and the board is reduction processed before a plating operation is carried out.
|
