发明名称 |
Polyimide precursor, bismaleimide-based cured resin precursor and electronic parts having insulating members made from these precursors |
摘要 |
A polyimide precursor having a molecular structure obtained by polymerizing (a) 0.97 to 1.03 molar equivalent of a diamine component containing 0.40 molar equivalent or more of aromatic diamine compound represented by the general formula (DA1), and (b) an acid anhydride component containing (1-n1/2) molar equivalent of a tetracarboxylic dianhydride and n1 molar equivalent of at least one selected from the group consisting of maleic anhydride and maleic derivative anhydride, wherein n1 ranges from 0.02 to 0.40. <IMAGE> (DA1)
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申请公布号 |
US5578697(A) |
申请公布日期 |
1996.11.26 |
申请号 |
US19950413173 |
申请日期 |
1995.03.29 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KAWAMONZEN, YOSHIAKI;OBA, MASAYUKI;MIKOGAMI, YUKIHIRO;MATAKE, SHIGERU;HAYASE, SHUZI;MIKOSHIBA, SATOSHI |
分类号 |
C08G73/10;G03F7/038;H01L23/29;H01L23/498;H01L23/532;(IPC1-7):C08G73/10 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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