| 摘要 |
PURPOSE: To obtain an epoxy resin composition, excellent in moisture and solder heat resistances and moldability, well balanced in characteristics and useful as a sealed semiconductor device having high reliability by using a specific epoxy resin, a specified phenolic resin and a specific silicon nitride powder. CONSTITUTION: This epoxy resin composition consists essentially of (A) an epoxy resin of formula I [R<1> is a group of (Cl H2l+1 ) ; (l) is 0 or an integer of >=1; (n) is an integer of >=1], (B) a naphthol resin of formula II, (C) a methyl methacrylate-butadiene-styrene copolymer resin and (D) a silicon nitride powder having 0.5-15% surface oxygen concentration due to an SiO2 layer and 10-50μm average particle diameter and contains 25-90wt.% component (D) based on the resin composition. The blending ratio of the component (C) is preferably 0.1-10wt.%, more preferably 1.0-5.0wt.% based on the whole resin composition. The sealed semiconductor device is readily obtained by sealing a semiconductor chip with a molding material prepared from the resin composition.
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